Manual Flip Chip Bonder CB-505 Athlete FA Model
Manual flip chip bonder suitable for small-scale production and various experiments.
The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.
- Company：日精 本社
- Price：10 million yen-50 million yen
